Laser beam soldering apparatus and soldering method using the same
US4914272A · kind A · utility
9Cited by
2References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 9, 1988 |
| Grant date | Apr 3, 1990 |
| Priority date | — |
| Expiry date | Sep 9, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3494
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A laser beam soldering apparatus is provided for soldering parts, such as, lead wires provided for an IC chip which are arranged closely to each other. The apparatus includes a plurality of laser beam irradiation units employing a semiconductor laser and a mounting dish for mounting the irradiation units. The dish has a plurality through holes for receiving the irradiation units. The irradiation units are mounted in the plate so as to be directed to one focal point to form a desired beam spot shape. A small beam spot having sufficient heat for soldering is thereby obtained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.