Method for the soldering of external connection wires to an electronic component
US4915286A · kind A · utility
11Cited by
6References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 10, 1989 |
| Grant date | Apr 10, 1990 |
| Priority date | — |
| Expiry date | Jul 10, 2009 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/40
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
According to the disclosed method for the soldering of wires of components, at least one wire is stamped to make it lose its symmetry of revolution. The result thereof is one or more impressions. A solder strip is crimped by deformation around the wire to form a solder preform held still by the impressions, which leaves free a surface of the wire. The component to be soldered, held against said surface of the wire, is soldered by reflow process. Application: the soldering of components such as disk ceramic capacitors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.