Patent · US Expired

Method for the attachment of components to a circuit board using photoactuatable adhesive

US4916805A · kind A · utility

29Cited by

8References

14Claims

0Family size

Assignee

ESPE Stiftung & Co. Produktions-und Vertriebs KG · DE

Inventors

Klaus Ellrich · Herrsching am Ammersee, DE
Oswald Gasser · Hanerau-Hademarschen, DE
Rainer Guggenberger · Hanerau-Hademarschen, DE
Erich Wanek · Kaufering, DE

Key dates

Filing date	Mar 1, 1989
Grant date	Apr 17, 1990
Priority date	—
Expiry date	Mar 1, 2009

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49146
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

For the attachment of components using the SMT method a procedure is suggested in which the adhesive used is activated prior to fitting of the components to the circuit board by irradiation with light having a wavelength in the range of 200 to 600 nm to such an extent that the desired initial tackiness is maintained and there is no formation of skin on the surface of the adhesive. This makes it possible to cause the adhesive composition to fully cure in a shorter time and at lower temperature than has been possible so far without the wettability of the adhesive during the fitting of the components to the circuit board being impaired.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.