Adhesive-coated wire and method and printed circuit board using same
US4918260A · kind A · utility
8Cited by
22References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 12, 1988 |
| Grant date | Apr 17, 1990 |
| Priority date | — |
| Expiry date | Sep 12, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2947
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Wire for repairing or changing circuit elements such as printed circuits, has heat-resistant insulation surrounded by a hot-melt adhesive. The wire is attached to the surface of printed circuit boards easily by applying a hot iron to the adhesive layer on the wire and melting the adhesive which then adheres to the board surface. The coating is applied by passing insulated wire vertically through a length of molten adhesive and then through a die. Printed circuit board modifications can be made quickly and easily and at a relatively low cost.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.