Solder deposition control
US4919970A · kind A · utility
22Cited by
12References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 15, 1986 |
| Grant date | Apr 24, 1990 |
| Priority date | — |
| Expiry date | Sep 15, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/163
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A technique for one step solder application through a mask to a printed circuit board (PCB) having pads for surface mountable components and through holes for a leaded components is disclosed wherein the amount of solder deposited on the pads and in the holes is simultaneously, independently controlled as a function of mask thickness, blade hardness and blade to mask angle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.