Patent · US Expired

Printed circuit manufacture employing a radiation cross-linkable photo-polymer system

US4920038A · kind A · utility

3Cited by

2References

8Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Klaus Budde · Unterhaching, DE
Oskar Nuyken · Munich, DE
Walter Melchior · Munich, DE

Key dates

Filing date	Nov 3, 1988
Grant date	Apr 24, 1990
Priority date	—
Expiry date	Nov 3, 2008

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/0394
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

In order to achieve a low dielectric constant and in order to improve the constant temperature resistance of radiation-sensitive synthetic resin lacquers, a photo-polymer system which is composed of a furyl acrylic acid esterified epoxy resin with phenoxy or epoxy end groups is employed as coating (2, 13, 4) on a substrate in the manufacture of printed circuits, particularly in multi-layer format. The cross-linking ensues with light in the wavelength range from about 150 through 400 nm preferably in the presence of a sensitizer without any following hot-hardening. As a consequence of its good solubility, the product can be easily processed and requires no intermediate layers when in a multi-layer format. A further area of employment lies in the field of integrated semiconductor circuits in VLSI technology when producing negative photo-resists.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.