Cooling system for an electronic circuit device
US4920574A · kind A · utility
62Cited by
3References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 30, 1987 |
| Grant date | Apr 24, 1990 |
| Priority date | — |
| Expiry date | Jul 30, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A cooling system including a cooling module which has a heat transfer plate that is exposed to a flow of coolant and is elastically biased toward a circuit component on a printed circuit board for transferring heat dissipated by the component to the coolant. A series of projections are provided on the heat transfer plate for producing turbulence in the flow of coolant. Alternatively, a cylindrical tubular plate is mounted on the heat transfer plate for increasing the surface area in contact with the flow of coolant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.