Semiconductor integrated circuit device
US4922324A · kind A · utility
56Cited by
4References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 19, 1988 |
| Grant date | May 1, 1990 |
| Priority date | — |
| Expiry date | Jan 19, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S257/916
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor integrated circuit device has a package base and a cavity formed with a ground electrode layer thereon. A semiconductor integrated circuit chip is providing on the ground electrode layer. De-coupling capacitors are providing on the surface of the cavity. A ground metal plate and outer leads are formed on the surface of the bottom of the package base. A metal connector is providing through the package base to connect electrically and thermally, the ground electode layer and the ground metal plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.