Method of making a current sensor
US4922606A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 18, 1988 |
| Grant date | May 8, 1990 |
| Priority date | — |
| Expiry date | Oct 18, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49199
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of making a current sensor device is disclosed wherein a sensor, having a magnetoresistive element configured into a bridge, an insulating substrate and a conductive member are sub-assembled and then the sub-assembly is heated to bond the components together. The bridge is attached to a first substrate having a first layer of insulation with first vias therein in which are deposited first elements of solder projecting beyond the first layer of insulation. Second elements of (e.g.) solder are deposited in second vias in a second layer of insulation on the second substrate. When the components are sub-assembled, the first elements rest on the second elements to provide a clearance between the first and second layers of insulation. Heat is applied to the sub-assembly in a controlled manner so that the (solder) elements melt sufficiently to cause a degree of self-alignment between the bridge and the conductive member and to cause the bridge to be disposed at a predetermined distance above the conductive member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.