Thermosetting bismaleimide resin composition containing an adduct of a propenylphenol and an epoxy compound
US4923928A · kind A · utility
6Cited by
7References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 18, 1988 |
| Grant date | May 8, 1990 |
| Priority date | — |
| Expiry date | Feb 18, 2008 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L79/085
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Prereact modifiers prepared by reacting a propenylphenol with an epoxy resin are useful in toughening heat curable bismaleimide resin systems so as to minimize impact produced damage, and which have exceptional gel times.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.