Memory card housing a semiconductor device
US4924076A · kind A · utility
40Cited by
3References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 11, 1988 |
| Grant date | May 8, 1990 |
| Priority date | — |
| Expiry date | Jul 11, 2008 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06K19/07743
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A memory card has an outer package comprising a first and a second package section which enclose a semiconductor device. An electrical connector is housed within the front end of the outer package. The front end of each package section overlaps the rear end of the electrical connector so that there are no gaps between the electrical connector and the package sections which could allow dirt or other contaminants to enter the outer package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.