Wire bonded microfuse and method of making
US4924203A · kind A · utility
17Cited by
4References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 29, 1988 |
| Grant date | May 8, 1990 |
| Priority date | — |
| Expiry date | Jun 29, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01H2085/0414
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A microfuse (10) with a ceramic chip (12), thick film pads (14), fusible wire (16), attached to pads (14) without solder or flux, in an insulating enclosure or fuse tube (40). Ferrules (42) are attached to metallized areas (14) with solder (44). Performance and manufacturing of fuse (10) is improved by utilizing a wire bonding technique to improve the quality of the manufacturing process and increase the reliability of the fuse, and to reduce manufacturing cost.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.