Multiple-chip semiconductor element in a case of metal and resin
US4924296A · kind A · utility
2Cited by
2References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 28, 1988 |
| Grant date | May 8, 1990 |
| Priority date | — |
| Expiry date | Jul 28, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multiple-chip semiconducting element in a case of metal and resin consists of a metallic plate, a body of synthetic resin which incorporates a portion of the plate, leaving free a larger surface thereof, and a large number of metallic terminals issuing from the same side of the resin body. Inside the resin body, a first semiconductor element chip is affixed to the metallic plate and a second semiconductor element chip is affixed to a metallic lamina made integral with at least one of the terminals and insulated electrically from the plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.