Recessed thermally conductive packaged semiconductor devices
US4924351A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 10, 1989 |
| Grant date | May 8, 1990 |
| Priority date | — |
| Expiry date | Apr 10, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A packaged semiconductor device having a semiconductor chip mounted on a bed part, a first molded layer which seals the bed part and the semiconductor chip such that the back of the bed part is exposed, a heat sink under the exposed back of the bed part and with a prescribed distance between it and the back of the bed part a second molded layer which is formed such that it covers the outside of the heat sink and the first molded layer, and also fills the gap between the exposed surface of the bed part and the heat sink, and leads which are disposed such that they pass through the second molded layer and their ends are in the first molded layer, and which are connected via bonding wires to the internal terminals of the semiconductor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.