Microwave integrated circuit substrate including metal filled via holes and method of manufacture
US4925723A · kind A · utility
16Cited by
2References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 29, 1988 |
| Grant date | May 15, 1990 |
| Priority date | — |
| Expiry date | Sep 29, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention is directed to a microwave integrated circuit formed on a substrate having via holes for either electrical grounding or heat dissipation or both and more particularly to a substrate including via holes which are filled with metal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.