Solder resist ink composition
US4925773A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 18, 1987 |
| Grant date | May 15, 1990 |
| Priority date | — |
| Expiry date | Dec 18, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S525/922
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A solder resist ink composition is disclosed which contains a photo-curable resin obtained by causing an unsaturated monocarboxylic acid to react with a cresolnovolak- or phenolnovolak-type epoxy resin, and causing a polybasic carboxylic anhydride to react with the resultant reaction product, a photo-curable resin obtained by causing an unsaturated monocarboxylic acid to react with a bisphenol A novolak- or cycloaliphatic oxirane novolak-type opoxy resin, and causing a polybasic carboxylic anhydride to react with the resultant reaction product, at least one photo-polymerizable compound selected from photo-polymerizable monomers, a photo-polymerization initiator, an organic solvent, and an inorganic filler. Also disclosed are two other solder resist ink compositions each having a different photo-curable component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.