Method for manufacturing electronic device including a vibration generating element
US4927580A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 14, 1988 |
| Grant date | May 22, 1990 |
| Priority date | — |
| Expiry date | Dec 14, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48247
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method for manufacturing an electronic device having therein a lead frame and a vibration-generating element integrally provided on the lead frame. The lead frame and the element are first provided in a metallic mold assembly comprising an upper mold portion and a lower mold portion, the upper and lower mold portions respectively having recess portions so as to form a cavity when the upper and lower mold portions are assembled with each other. A first sealing material is injected into the cavity so that the element is covered by the injected first sealing material, the first sealing material having a shrinkage property and a low adhesion property. After solidification of the injected first sealing material, they are removed from the mold assembly and then immersed in a second sealing material at a vacuum state so that the second sealing material is impregnated between the first sealing material portion and the lead frame. The second sealing material impregnated therebetween is hardened so as to seal a gap formed therebetween.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.