Surface mounting leadless components on conductor pattern supporting substrates
US4927697A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Nov 28, 1988 |
| Grant date | May 22, 1990 |
| Priority date | — |
| Expiry date | Nov 28, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Flux residue drawn by capillary action into the small gap between a conductor pattern support e.g. a printed circuit board, and a leadless electronic component surface mounted on the support is hard to remove and may corrode the conductor pattern. Herein the component is fixed to the support by a pad of adhesive elastomer so as to give a larger and hence more easily cleanable gap between component and support and the component connector pads are coupled to the conductor pattern by way of solder pillars formed by pre-loading the component connector pads and the pattern with precisely defined amounts of solder and, e.g. during a vapor phase re-flow, causing the pre-loads to merge and form the solder pillars.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.