Method of making a wire bonded microfuse
US4928384A · kind A · utility
14Cited by
8References
38Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 6, 1989 |
| Grant date | May 29, 1990 |
| Priority date | — |
| Expiry date | Oct 6, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49107
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A microfuse (10) with a ceramic chip (12), thick film pads (14), fusible wire (16), attached to pads (14) without solder or flux, ceramic coating (18) and plastic body (20). External lead (24) configuration can be axial, radial or surface mount. The method of manufacturing the fuse (10) is improved by utilizing a wire bonding technique in order to improve the quality of the manufacturing process and increase the reliability in performance of the fuse and reduce manufacturing cost.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.