Method for electroplating a conducting surface

US4929315A · kind A · utility

Assignee

• AUDI AG · DE

Inventors

• Siegfried Schaper · Wettstetten, DE
• Martin Seufert · Steinheim, DE

Key dates

• Filing date: Feb 9, 1989
• Grant date: May 29, 1990
• Expiry date: Feb 9, 2009

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C25D5/022
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A process for galvanic coating of a selected area on a preform, comprising applying an electrically conducting metallic primer to substantially the entire surface of the preform; masking a portion of the surface coated leaving exposed an unmasked portion not to be coated; forming a clear coat to the exposed portion not to be galvanized; removing the mask to expose the portion of the surface not clear coated; and galvanically coating the area of metallic primer.