Low toxicity alloy compositions for joining and sealing
US4929423A · kind A · utility
32Cited by
5References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 31, 1989 |
| Grant date | May 29, 1990 |
| Priority date | — |
| Expiry date | Mar 31, 2009 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC22C13/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A lead-free alloy for joining and sealing which is useful as a plumbing solder comprises from 0.08 to 20% by weight of bismuth, from 0.02 to 1.5% by weight of copper, from 0.01 to 1.5% by weight of silver, from 0 to 0.10 percent by weight of phosphorus, from 0 to 0.20% of a rare earth mixture and the balance tin, together with incidental impurities. The alloy has a similar pasty range (i.e. melting temperature and melting range) to the traditional tin-lead plumbing solders.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.