Epoxy resin compositions
US4929708A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 26, 1986 |
| Grant date | May 29, 1990 |
| Priority date | — |
| Expiry date | Nov 26, 2006 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G59/621
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Disclosed are epoxy resin compositions comprising a 1,1-bis(4-hydroxyaryl) lower alkane type epoxy resin, hydroquinone and a reaction catalyst, or a 1,1-bis(4-hydroxyaryl) lower alkane type epoxy resin and N-aminoalkyl-substituted piperazine or a modified product thereof. These epoxy resin compositions as prepared are in a liquid state and hence resin moldings can be manufactured therefrom by such a simple technique as casting. It is also possible to cure these resin compositions at a temperature below 150.degree. C., and the resin moldings obtained therefrom are tough and excellent in impact resistance as well as in heat resistance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.