Combination of a support and a semiconductor body and method of manufacturing such a combination
US4929999A · kind A · utility
34Cited by
9References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 4, 1989 |
| Grant date | May 29, 1990 |
| Priority date | — |
| Expiry date | Apr 4, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49153
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to the combination of a support and a semiconductor body and to a method of manufacturing same, in which a deformable metal layer is disposed between the semiconductor body and the support. The semiconductor body is connected to the support by pressing the semiconductor body and the support against each other under pressure after heating the metal layer. The semiconductor body is then provided at its surface facing the support with at least one projecting part, which is embedded in the metal layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.