Advanced heat pump
US4930322A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 11, 1989 |
| Grant date | Jun 5, 1990 |
| Priority date | — |
| Expiry date | Sep 11, 2009 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF24F2003/144
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat pump is disclosed which includes a first packed bed of liquid desint for removing moisture from outside air in the heating mode of operation, and a pump for transferring the moisture laden desiccant to a second packed bed which humidifies condenser heated inside air by adding water vapor to the air. The first packed bed, by removing moisture from the outside air before it passes through the heat pump's evaporator coils, prevents frost from forming on the coils. In the cooling mode of operation the second packed bed of liquid desiccant removes water vapor from the air inside of the building. The moisture laden desiccant is then transferred to the first packed bed by a second pump where condenser heat transfers the moisture from the desiccant to outside air.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.