Method of using laser routing to form a rigid/flex circuit board
US4931134A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 15, 1989 |
| Grant date | Jun 5, 1990 |
| Priority date | — |
| Expiry date | Aug 15, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of fabricating a multilayer circuit board having rigid and flexible sections using Z-axis laser routing. A rigid superstructure is provided for lamination to a flexible circuit substrate, wherein the superstructure includes specially configured strips of laser reflective material, disposed on the laminating surface thereof, defining the boundary between the rigid and flexible sections of the multilayer circuit board. In subsequent processing, a beam of laser energy is directed through the rigid superstructure, along the Z-axis thereof, superjacent to each strip of laser reflective material, thereby cutting through the material of the superstructure creating a laser routed channel which forms an interface between the rigid and flexible sections of the finished multilayer circuit board. In a further step, the portion of the rigid superstructure residing between the laser routed channels is separated and removed, there by exposing the underlying flexible substrate, resulting in a flexible section on an otherwise rigid laminated composite and creating a multilayer rigid/flex circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.