Selective electroplating apparatus and method of using same
US4931150A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | May 8, 1989 |
| Grant date | Jun 5, 1990 |
| Priority date | — |
| Expiry date | May 8, 2009 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D7/04
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electroplating apparatus for rapidly depositing a metal onto a selected surface of a workpiece, which apparatus comprises an anode having an active surface with a selected shape to combine with the selected surface of the workpiece to define an elongated gap of at least about 0.050 inches, means for supporting this anode in a fixed position to define the elongated gap; solution circulating means for forcing an electroplating solution with metal cations through the gap in a generally closed path at a velocity to exchange electroplating solution in the gap at a rate of at least 25 times per minute; and, means for applying current flow between the selected workpiece surface and the active surface of the anode through the gap at a current density in excess of 2.0 amperes/in.sup.2. The invention also involves the method of using this apparatus to rapidly deposit metal, such as nickel, onto the inner cylindrical surface of a bore on a complex part such as an aircraft landing gear forging.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.