Composition comprising poly(p-hydroxystrene) derivative, epoxy-modified polybutadiene and aromatic maleimide
US4931507A · kind A · utility
2Cited by
2References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 2, 1988 |
| Grant date | Jun 5, 1990 |
| Priority date | — |
| Expiry date | Nov 2, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/3528
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention provides a thermosetting resin composition comprising PA1 (a) a prepolymer of a poly(p-hydroxystyrene) derivative represented by the general formula ##STR1## wherein A is a halogen group, R.sub.1 is an alkenyl or alkenoyl group of 2 to 4 carbon atoms, m denotes a number of 1 to 4 and n denotes a number of 1 to 100, PA1 (b) an epoxy-modified polybutadiene, and PA1 (c) an aromatic maleimide compound, and a prepreg and a laminated sheet which use said resin composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.