IC card and method of manufacturing the same
US4931853A · kind A · utility
72Cited by
2References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 6, 1989 |
| Grant date | Jun 5, 1990 |
| Priority date | — |
| Expiry date | Sep 6, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An IC card comprises a thermoplastic resin core sheet and an IC chip bearing a conductive projection formed on an electrode of the IC chip, the IC chip being embedded in the core sheet in such a manner that the exposed top surface of the conductive projection is made flush with the main surface of the core sheet. A conductive layer pattern formed on the main surface of the core sheet is extended for contact with the exposed top surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.