Ultra-high density electrical interconnect system
US4932902A · kind A · utility
22Cited by
2References
36Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 21, 1989 |
| Grant date | Jun 12, 1990 |
| Priority date | — |
| Expiry date | Mar 21, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R2107/00
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An ultra-high density electrical interconnect system is described wherein the pins and sockets are generally triangular in cross-section. This configuration allows for a density of 400 or more contacts per square inch wherein the contacts are supported on a grid pattern having 50 mil or less spacing between intersections. Further, the substrate supporting the contacts need be no wider than 50 mil per row of contacts. Still further, at least three rows and columns of contacts may be provided with the 50 mil or less spacing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.