Thermosetting resin and prepreg and laminate using the same
US4933228A · kind A · utility
8Cited by
2References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 19, 1989 |
| Grant date | Jun 12, 1990 |
| Priority date | — |
| Expiry date | Jun 19, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/674
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A thermosetting resin composition comprising a special poly(p-hydroxystyrene) derivative resin and a radical polymerization initiator, and if necessary an epoxy modified polybutadiene, can provide prepregs and laminates having a low dielectric constant, a shorter signalling delay time, good heat resistance and flame retardancy and thus being suitable for producing multilayer printed circuit boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.