Curable epoxide resin compositions
US4933392A · kind A · utility
13Cited by
5References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 7, 1989 |
| Grant date | Jun 12, 1990 |
| Priority date | — |
| Expiry date | Jul 7, 2009 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L63/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Curable compositions comprise: PA0 (A) an epoxide resin PA0 (B) as latent curing agent for (A), dicyandiamide or a polycarboxylic acid hydrazide, and PA0 (C) as cure accelerator dispersed as a powder in the composition, a Mannich base of a polymeric phenol. The compositions are particularly useful as adhesives and sealants.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.