Solderless printed wiring board module and multi-module assembly
US4933808A · kind A · utility
62Cited by
17References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 11, 1989 |
| Grant date | Jun 12, 1990 |
| Priority date | — |
| Expiry date | May 11, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0186
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A solderless printed wiring board module for receiving and securing surface mounted solderless electronic component carrier and electronic components without carrier upon a printed wiring board, the module also providing a heat transfer path to a surface away from the printed wiring board and the module further adaptable to electrical and mechanical attachment to similar modules placed adjacent to said module to form a multi-module assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.