Process of bonding an electrical device package to a mounting surface
US4935086A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 8, 1986 |
| Grant date | Jun 19, 1990 |
| Priority date | — |
| Expiry date | Oct 8, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A thermally conductive adhesive, and processes for formulating the same, are provided for bonding an electrical device package, such as an integrated circuit (IC) package, to a surface of a substrate, such as a printed circuit board. The thermally conductive adhesive comprises a polyurethane-based resin material and a predetermined amount of thermally conducting, electrically insulating material, such as alumina, mixed therewith. With such arrangement, a thermally conductive adhesive is provided having a low modulus of elasticity. Thus, such adhesive is soft and pliable rather than rigid, and thus deforms in response to the different amounts of thermal expansion, or contraction, of the IC package and PCB against, or away from, the thermally-conductive adhesive, thereby preventing damage to either the IC package or PCB, or separation of solder joints therebetween, due to such thermal expansion or contraction. Additionally, such adhesive has a low bond strength, thus allowing an IC package to be removed from a PCB without damaging either the IC package or PCB. Also, such adhesive is found to have low outgassing properties. The thermally conductive adhesive may be formed into a film, …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.