Adhesively bonded photostructurable polyimide film
US4935320A · kind A · utility
25Cited by
34References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 12, 1988 |
| Grant date | Jun 19, 1990 |
| Priority date | — |
| Expiry date | Aug 12, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31855
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Coated material containing in successive order PA1 (a) a substrate, PA1 (b) a photostructurable negative-working thermostable adhesive and PA1 (c) a self-supporting photocrosslinkable polyimide film. This arrangement can be used for producing relief images by means of photolithhographic processes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.