Method of fabricating a printed circuit board and the PCB produced
US4935584A · kind A · utility
90Cited by
13References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 24, 1988 |
| Grant date | Jun 19, 1990 |
| Priority date | — |
| Expiry date | May 24, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49126
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board is fabricated from first and second composite sheets, each composed of a substrate of dielectric material and at least one conductor run adhered to the substrate. The substrate of the second composite sheet is formed with a through hole adjacent to the conductor run of that sheet. The second composite sheet is adhered to the first composite sheet, with the conductor run of the first sheet exposed through the hole in the second sheet. Conductive material is introduced into the hole and provides an electrically-conductive connection between the conductor runs of the two sheets.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.