Patent · US Expired

Electrical interconnection apparatus for achieving precise alignment of hybrid components

US4935627A · kind A · utility

8Cited by
14References
21Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 13, 1989
Grant dateJun 19, 1990
Priority date
Expiry dateMar 13, 2009

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10F39/1843

Abstract

Apparatus for electrically interconnecting a focal plane array component of infrared detectors to a second focal plane array component of electronics, such as multiplexers. First and second interconnecting members are comprised of indium bumps wherein the bumps are of generally rectangular shape and of nonparallel orientation, typically crossing at 90.degree. angles. An alternative embodiment uses bumps of generally round shape wherein one of the bumps is of a smaller surface area than the other.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.