Electrical interconnection apparatus for achieving precise alignment of hybrid components
US4935627A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 13, 1989 |
| Grant date | Jun 19, 1990 |
| Priority date | — |
| Expiry date | Mar 13, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/1843
Abstract
Apparatus for electrically interconnecting a focal plane array component of infrared detectors to a second focal plane array component of electronics, such as multiplexers. First and second interconnecting members are comprised of indium bumps wherein the bumps are of generally rectangular shape and of nonparallel orientation, typically crossing at 90.degree. angles. An alternative embodiment uses bumps of generally round shape wherein one of the bumps is of a smaller surface area than the other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.