Localized cooling apparatus for cooling integrated circuit devices
US4935864A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 20, 1989 |
| Grant date | Jun 19, 1990 |
| Priority date | — |
| Expiry date | Jun 20, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S323/907
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A localized cooling apparatus is provided for individually cooling integrated circuit chips mounted on a circuit board for insertion into a computer backplane. The cooling apparatus consists of a circuit board occupying a first slot and having an integrated circuit chip mounted thereon, the performance of which is known to improve by cooling, a heat removal assembly consisting of a heat sink attached to a card edge portion and occupying an adjacent second slot, and a thermoelectric cooler intimately bonded to both the chip and heat removal assembly. A controller provides power via the connector of the second slot to the thermoelectric cooler and stabilizes the temperature of the chip to a predetermined value.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.