High-speed solder compositions
US4937045A · kind A · utility
2Cited by
2References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 25, 1990 |
| Grant date | Jun 26, 1990 |
| Priority date | — |
| Expiry date | Jan 25, 2010 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K35/262
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A solder composition for use in high-speed hand-soldering of art work or other artifacts consisting essentially of from about 51% to about 56% by weight tin, from about a trace to about 1.0% by weight antimony, and the balance being substantially lead.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.