Thermoplastic moulding compositions
US4937286A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 13, 1987 |
| Grant date | Jun 26, 1990 |
| Priority date | — |
| Expiry date | Oct 13, 2007 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L51/04
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Thermoplastic moulding compositions of PA0 A. 90 to 30 parts by weight of a copolymer prepared by solution or bulk polymerization of a.sub.1 30 to 45% by weight of .alpha.-methylstyrene, a.sub.2 26 to 35% by weight of acrylonitrile and a.sub.3 44 to 20% by weight of styrene and/or p-methylstyrene, and with a content of incorporated acrylonitrile of 27-30% by weight, PA0 B. 5 to 60 parts by weight of a random copolymer of b.sub.1 18 to 24% by weight of maleic anhydride and b.sub.2 82 to 76% by weight of styrene and/or p-methylstyrene and PA0 C. 5 to 40 parts by weight of a graft polymer of 70 to 30% by weight of a mixture of c.sub.1 a vinylaromatic and/or C.sub.1 -C.sub.4 -alkyl and c.sub.2 acrylonitrile, on 30 to 70% by weight of a rubber with a glass transistion temperature of less than -10.degree. C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.