Polymer useful for molding into a circuit board subtrate
US4937309A · kind A · utility
1Cited by
2References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 14, 1989 |
| Grant date | Jun 26, 1990 |
| Priority date | — |
| Expiry date | Aug 14, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0333
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Described are select polyarylethersulfones polymers which are useful for molding into a circuit board substrte. When metal is electroplated onto such a substrate, there is a high degree of adhesion of the metal to the circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.