Installation of surface mount components on printed wiring boards
US4937934A · kind A · utility
6Cited by
6References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 10, 1989 |
| Grant date | Jul 3, 1990 |
| Priority date | — |
| Expiry date | Feb 10, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49156
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Movement of surface mount components during soldering onto TEFLON.TM. printed wiring boards is prevented by applying a strip of solder mask material to a solder pad to define a component lead area and applying solder to areas of the areas of the solder pad not covered by the solder mask strip. Solder paste is applied to the component bad area and the surface mount component is positioned with a lead in registry with the component lead area. The entire board is then heated to mechanically and electrically adhere the component lead to the pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.