Liquid-cooled, flat plate heat exchanger
US4938280A · kind A · utility
Inventor
Key dates
| Filing date | Nov 7, 1988 |
| Grant date | Jul 3, 1990 |
| Priority date | — |
| Expiry date | Nov 7, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49385
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A one-piece, substantially flat and very thin heat exchanger core in accordance with this invention has two flat and parallel surfaces, with each of said surfaces being suitable as a mounting surface for a number of heat producing electronic chips. These surfaces are closely spaced and separated by a single cavity for conveying a fluid coolant, and the cavity contains a plurality of closely spaced pins extending the full distance between the parallel surfaces. The pins are formed and permanently joined to both of the parallel surfaces, and quite significantly, this is accomplished with creation of a seam. Each pin is capable of having a hole installed through for its entire length, from one of the flat surfaces to the other, without breaching the fluid cavity and without creating a path for fluid to leak from the fluid cavity to the ambient. Also significant is the novel method by which this heat exchanger is constructed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.