Cathode sputtering system
US4938858A · kind A · utility
14Cited by
11References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 31, 1989 |
| Grant date | Jul 3, 1990 |
| Priority date | — |
| Expiry date | Jul 31, 2009 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/352
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A cathode sputtering system comprising an annularly-shaped process chamber and a correspondingly annularly-shaped substrate carrier accommodated therein. The chamber and carrier are positioned vertically. A cathode station and a loading and unloading station are positioned on vertical walls of the chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.