Non-destructive method for evaluation of printed wiring boards
US4939469A · kind A · utility
14Cited by
9References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 1, 1988 |
| Grant date | Jul 3, 1990 |
| Priority date | — |
| Expiry date | Aug 1, 2008 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2805
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for evaluating characteristics of a printed wiring board by measuring the alternating current impedance spectra of the printed wiring board conductor pattern. The method is useful in evaluating a number of different characteristics, such as moisture content, delamination, interlayer thickness and surface characteristics.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.