Single phase toughened heat-curable resin systems exhibiting high strength after impact
US4940740A · kind A · utility
9Cited by
8References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 21, 1989 |
| Grant date | Jul 10, 1990 |
| Priority date | — |
| Expiry date | Apr 21, 2009 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G59/38
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Heat curable epoxy resin systems are disclosed which may be cured to form monophasic matrix resins and adhesives which, when utilized as matrix resins in carbon fiber reinforced composites, are capable of forming quasiisotropic panels having CAI values greater than 275 MPa after an impact of 6.68 kJ/m, and which maintain their tack after extended storage at room temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.