Hermetically tight glass-metal housing for semiconductor components and method for producing same

US4940855A · kind A · utility

Assignees

• Siemens Aktiengesellschaft · DE
• Electrovac GESMBH · AT

Inventors

• Guenther Waitl · Regensburg, DE
• Rolf Birkmann · Hemau, DE
• Ewald Schmidt · Ludwigsburg, DE

Key dates

• Filing date: Sep 20, 1988
• Grant date: Jul 10, 1990
• Expiry date: Sep 20, 2008

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/49121

Abstract

A hermetically tight glass-metal housing for semiconductor components and a method for producing the housing includes a base support for a semiconductor component in the form of a conducting strip having an upper portion and being suitable for functioning as a lead frame. A mounting pedestal is disposed at the upper portion of the conducting strip. Electrical contacts are disposed at the upper portion of the conducting strip for electrical connections with the semiconductor component. A metal ring is hermetically tightly sealed to the upper portion of the conducting strip. A metal cap surrounds the semiconductor component and the metal ring forms a connecting element for a tight weld with the metal cap.