Thermosetting insulating resin paste
US4942190A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 21, 1988 |
| Grant date | Jul 17, 1990 |
| Priority date | — |
| Expiry date | Oct 21, 2008 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K5/3445
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A thermosetting insulating resin paste including 100 parts by weight of an epoxy resin containing a diglycidyl type liquid epoxy resin as a main component and based on the parts by weight of the epoxy resin, 0.5 to 10 parts by weight of dicyandiamide as a setting agent. It further contains 1 to 15 parts by weight of a phenoxy resin, 0.1 to 8 parts by weight of 2-phenyl-4-methyl-5-hydroxymethylimidazole and/or 2-phenyl-4,5-dihydroxymethylimidazole as a setting accelerator as well as 50 to 200 parts by weight of a thermally conductive filler. This insulating resin paste exhibits a long pot life and can be set in a short time at a low temperature without generating any voids during the setting, so that it enables the die bonding process in the production of semiconductor devices to be performed as part of the production line. It also allows a smaller device to be used in this process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.