Adhesive for low temperature applications
US4942201A · kind A · utility
50Cited by
6References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 29, 1988 |
| Grant date | Jul 17, 1990 |
| Priority date | — |
| Expiry date | Aug 29, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S525/902
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Adhesive compositions are made from methacrylate ester monomers, elastomeric polymers having a Tg below -25.degree. C. and which are soluble in the monomers, core-shell polymers which swell in the monomers but do not dissolve therein, and free radical producing catalysts. These adhesive compositions when used in bonded assemblies exhibit a combination of high adhesive bond impact strength and high bulk tensile elongation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.