Cathode sputtering system

US4943363A · kind A · utility

Assignee

• Leybold GmBH · DE

Inventors

• Jaroslav Zejda · Rodenbach, DE
• Manfred Schuhmacher · Alzenau, DE

Key dates

• Filing date: Jul 10, 1989
• Grant date: Jul 24, 1990
• Expiry date: Jul 10, 2009

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/6835
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A cathode sputtering system for coating substrates in a vacuum chamber in which a rotating substrate carrier is accommodated and comprises at least one conveyor spoon. The conveyor spoon comprises a substrate receptacle member and an arm attached between the receptacle member and a rotating disk. The arm preferably comprises two leaf springs arranged parallel to one another. During the sputtering process, a pressure plate presses the substrate receptacle member and the substrate against a mask that is part of the cathode station. As a result, a cathode vacuum space is formed that is isolated from the vacuum space of the system.