Low pressure bonding of PCD bodies and method for drill bits and the like
US4943488A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 18, 1988 |
| Grant date | Jul 24, 1990 |
| Priority date | — |
| Expiry date | Nov 18, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/30
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
An improved temperature stable synthetic polycrystalline diamond (PCD) product includes at least one temperature stable PCD integrally and chemically bonded to a matrix carrier support through a carbide forming layer which is of a thickness of at least about 1 micron, the layer on at least one surface of the PCD is in turn bonded to the matrix carrier. A wide variety of shapes, sizes and configurations of such products is achieved through relatively low temperature and relatively low pressure processing. Various products of various geometries are described as well as the details of the processing to achieve chemical bonding of the PCD elements in a variety of support matrix carrier materials to form a unitary structure having a temperature stability up to about 1,200 degrees C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.